BGA rework machine
All-Purpose, High-Precision SMT/BGA Rework System Under $15K
Posted by Manncorp
Fully-equipped for less than $15K, the RW1200 handles boards up to 16.1" x 14.6" and sets new standards for quality, versatility, and affordability.
Manncorp will introduce its exclusive, new RW1200 SMT/BGA Rework System at booth #3732 of the IPC APEX EXPO in San Diego, Feb. 24-26.
Designed to tackle today’s most challenging surface mount board repairs, Manncorp’s new RW1200 SMT BGA Rework Machine includes capability that, until now, was only available in more costly high-end equipment. High-definition vision, rapid-response IR underheating, and ultra-precise component alignment are just a few exclusive features that allow the RW1200 to remove and replace the industry’s most advanced SMDs. Fully-equipped for less than $15K, the RW1200 handles boards up to 16.1" x 14.6" and sets new standards for quality, versatility, and affordability.
The RW1200 comes standard with a 1.3 million pixel, split-vision CCD camera and a 15” 1080p HD display. Joystick-controlled zoom with 230x magnification and high-brightness LED lighting provide ultra-clear, superimposed views of component leads and PCB solder pads for easy alignment using ultra-fine X, Y, and Θ axis micrometers. In conjunction with its high-precision Z-axis drive mechanism and automatic height sensing, the RW1200 provides the ±0.01mm placement accuracy needed for 0.3 mm (0.012") lead pitch µBGAs and delicate QFPs.
A full assortment of heater nozzles, in a variety of standard and custom sizes for components from 2 x 2 mm to 55 x 55 mm, direct up to 1200W of hot air from the upper heater to the component. Adjustable hot air flow control helps to prevent even the smallest chip components from shifting during reflow. The 1200W bottom heater, essential for BGA repair, is surrounded by a 2700W, rapid IR underheater that quickly and efficiently heats the entire bottom surface of the PCB to prevent board warpage, reduce cycle times, and limit temperature exposure.
The RW1200’s ergonomic design and user-friendly touchscreen control software are also Manncorp exclusives. Set temperature versus actual temperature profiles measured through the unit’s built-in thermocouple input can be recorded and exported to a flash drive connected to a USB port on the front of the machine.
For a limited time, Manncorp is offering free, on-site installation and training on the RW1200, which is also backed by a full two-year parts warranty and unlimited factory support.
Manncorp BR790-HD’s High-Definition Optics and Real-Time Temperature Profiling Conquer SMD Rework’s Most Challenging Tasks
From Manncorp
Manncorp's BR790-HD rework system
allows operators to safely remove, align, place and solder BGAs, CSPs,
ultra-fine-pitch QFPs, and other delicate, heat-sensitive SMDs with
unprecedented ease and precision.
Manncorp BR790-HD's High-Definition Optics and Real-Time Temperature Profiling Conquer SMD Rework's Most Challenging Tasks
The BR790-HD's 1.3 million pixel, split-vision optics and 15" high-resolution display make fast, accurate work of component alignment via crystal-clear, superimposed images of leads and solder pads. A handy component presentation nest, mounted to the optics’ X and Y drives, automates pickup and positioning of the component in the camera’s field of view and reduces handling of delicate SMDs.
Five separate input connectors allow strategic positioning of K-type thermocouples at critical locations on the component and PCB. An easy-to-use LCD touchscreen interface displays real-time temperatures and allows on-the-fly adjustment of top and bottom hot air heater settings for ultra-precise profiling. Screen captures of process profiles can be saved to an external USB flash or hard drive for traceability.
PCB positioning is easy, thanks to the BR790-HD's unique, edge-clamping system, which easily adjusts to fit boards up to 21.6" x 19.7" (550 x 500 mm). During setup, an innovative laser guide allows trouble-free alignment of the rework site with the system's top- and bottom-side heater nozzles.
For alignment of components to solder pads, the board holder includes ultra-fine micrometer adjustments of the X and Y axes. Correction of angular alignment is performed by rotating the pickup head’s motorized theta axis through the touchscreen interface or via a manual override on the head. During automatic component removal and placement, an optoelectronic sensor controls Z-axis positioning and contact force.
The BR790-HD's programmable 6-zone "Rapid IR" underheater evenly heats the bottom of the board, eliminating thermal gradients and stress on components and solder joints adjacent to the rework site. Capable of supplying up to 3600 watts of heating power, it also reduces overall cycle times and maximum temperature exposure. Built-in cooling fans blow ambient air across the PCB at the end of the cycle.
The BR790-HD BGA rework station is well suited for use with virtually any rework application. Its short learning curve and user-friendly design puts precision rework in the hands of even inexperienced operators. Visit http://www.manncorp.com/smt/prod-483/BGA-SMD-rework-station-BR790HD.html for specifications, pricing, and a video of the machine in operation.
Meet the Rework Challenges of BGAs, CSPs, and Ultra-Fine-Pitch QFPs
Posted by Manncorp
BR790-HD BGA Rework System - High-Definition, Auto-X-Y Split-Vision Alignment for Automatic Removal, Placement, and Soldering of BGAs, CSPs, QFPs, and Other SMDs
For more information, please visit the website: Manncorp BR790-HD BGA Rework Station
BR720 BGA Rework Station Split-Vision Alignment for Automatic Removal, Placement, and Soldering of BGAs, CSPs, QFPs, and Other SMDs
Posted by Manncorp
The Manncorp BR720 is the industry's most affordable BGA rework station to feature split-vision optics, fully-programmable top and bottom heating, an integral thermocouple input, and a large-area multi-zone IR underheater — features essential for safe and reliable removal, placement, and soldering of BGAs, ultra-fine-pitch QFPs, and other challenging surface mount repairs. The split-vision optics and camera assembly is mounted to a precision X-Y slide mechanism that allows easy positioning between the component and the PCB.
| Easily Adjustable PCB Holder Accepts Boards Up To 550 mm x 500 mm (21.6" x 19.7") The BR720's unique board holding system accommodates virtually any surface mount or mixed technology PCB assembly up to 550 mm x 500 mm (21.6" x 19.7"). A wide range of X- and Y-axis adjustability, combined with an innovative quick-release clamping mechanism, universal PCB support rails, and a moveable multi-zone IR underheater ensure that any application set-up can be optimized to take full advantage of all the BR720’s advanced features. |
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| X, Y, and Theta Axes Micrometer Adjustments for Precise Alignment of Component Leads to PCB Pads Ultra-fine micrometers on the PCB holder for X- and Y- axes, and an additional one on the pick-up head for the theta axis, allow fast, easy, and precise alignment of the component leads to the PCB pads with the aid of high-resolution superimposed images of the board and the component projected through the Split-Vision Optics onto the LCD display. |
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| Innovative Laser Guide for Easy Alignment of Component Over Bottom Side Heater Proper setup of the BR720 calls for alignment of the bottom heater, the component, and the top heater in the Z axis. Positioning the board in the PCB holder so that the component on the top side is positioned directly over the bottom heater nozzle is facilitated with a handy laser pointer that is attached to the upper heater and is targeted at the virtual center of the bottom heater. Positioning the component on the PCB below the laser spot ensures that the bottom heater, component, and upper heater are virtually aligned and reduces setup time. |
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| Split-Vision Optics Provide Superimposed Images of Leads and Pads for Precise Alignment Split-Vision Optics, with electronic zoom and focus, and high-brightness adjustable LED lighting provide high-contrast superimposed images of the component leads (as it is being held on the placement head) and the pads on the PCB. The operator views this image on the BR720ís full color LCD display and if the component leads (which appear blue on the display) are misaligned with the pads on the PCB as shown in the upper image at left, the X-, Y-, and Theta axes micrometer adjustments can then be used to align the component and board as shown in the bottom image. Once the component leads and pads are aligned, precise placement is ensured. |
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| Intuitive Touch-Screen Interface with One-Touch Operation and Parameter Adjustment On-the-Fly The BR720 features an easy to use touch-screen interface with password protected user privileges that separate operator and administrative/programming functions. Operator controls allow one-touch functionality for desoldering operations with automatic placement and soldering also taking place at the touch of a button. When creating profiles, the ability to edit parameters from the same screen where the real-time temperature profile is displayed provides almost instantaneous feedback and reduces setup time. |
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| Programmable Heating Rate, Target Temperature and Dwell Time for Upper and Lower Heaters Sets of profile parameters for both leaded and lead-free solders can be divided into as many as eight individual segments for both the top and bottom heaters, each with its own heating rate, target temperature, and dwell time at the targeted temperature. Temperature and power settings for the IR underheater and the duration of the cooling fan operation are also saved as part of the parameter set. |
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| Real-Time Data Recording via Thermocouple Input with Profile Analysis and Print Function A thermocouple input on the front of the unit allows real-time monitoring of temperatures at the desired location on the component or PCB. Collected data can be analyzed to ensure consistency with solder and/or component manufacturerís recommendations and can also be captured in bitmap format and written to a memory device connected to the BR720's standard USB port. |
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| Full Set of Vacuum Nozzles Included for Automatic Pick-Up and Placement of SMDs The BR720 comes with a complete set of vacuum nozzles to handle components from 3 mm x 3 mm up to 60 mm x 60 mm and a maximum weight of 70 grams. Adapter sleeves attach to the standard vacuum nozzles to increase contact area and pick-up force. Components less than 3 mm x 3 mm should be placed manually and soldered in the BR720's Manual mode. |
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| Bottom Heater Nozzles Included To Handle Most All BGA and CSP Applications The BR720 is also shipped with 36 mm x 36 mm and 58 mm x 58 mm bottom heater nozzles to accommodate 95% of all rework applications involving removal and resoldering of BGAs, CSPs, and other devices that require bottom heating. Bottom heater nozzles can also be supplied in custom sizes for applications that require confinement of heat to a smaller area. |
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| Wide Variety of Upper Heater Nozzles To Solder or Desolder Virtually Any SMD Nozzles for the upper heater are ordered based on the user's needs and are available in virtually any size from 7 mm x 7 mm to 55 mm x 55 mm to direct heat to the top surface and perimeter leads of a surface mounted device. A full listing of standard nozzles and pricing is available on the BR720 Insta-Quote page, and custom sizes are also available upon special request. Upper Heater Nozzles feature toolless, snap-in installation and can be swapped out in seconds. |
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For more information, please go to the website: BR720 BGA Rework Station