SMT reflow oven

Android(TM) Operating System Controls New Benchtop Reflow Oven

Posted by Manncorp

MC301 benchtop reflow oven
Android(TM) Operating System Controls New Benchtop Reflow Oven

An innovative Android-based operating system and high-resolution touchscreen user interface only begin to explain why Manncorp’s new MC-301 Benchtop Reflow Oven is among its hottest new products for 2014. By simulating the environment of an inline reflow system in a small footprint, the MC-301 is ideal for prototyping, manufacturability testing, and even short-run batch production. Its exclusive Android control app allows surface mount assemblers and product developers to meet solder paste manufacturers’ precise specifications for the preheat, soak, reflow, and cooling phases of their recommended profiles. Heating and cooling rates in each stage are also automatically calculated to easily verify compliance with component and material requirements.

The system includes an internal thermocouple that can be used to measure and record actual temperatures at strategic locations on the PCB while soldering. In the advanced mode, real-time feedback from the thermocouple can be used to control heater power and to establish optimal temperature settings for various applications. Android architecture allows users to easily save, store, and transfer recorded data and process parameters conveniently across networks via integrated WiFi.

Unlike other batch reflow ovens, the MC-301 heating chamber is divided into multiple heating zones; each one assigned to its own channel of the temperature control system. This advanced design eliminates thermal gradients within the oven and ensures minimal delta-T (±2 °C) across its 10" x 8" working area. Rapid cooldown is achieved with the aid of high-efficiency intake fans that draw air through the bottom of the unit and out through the 3" exhaust port at the top rear. Measuring only 27" x 19" x 11" and weighing in at less than 100 lbs., the MC-301 is an excellent choice for labs, schools, small production facilities, or other installations where space is often at a premium.

“The Android platform is the perfect fit for the MC-301,” says Manncorp President, Henry Mann, “because it’s so consistent with our objective to utilize cutting-edge technology to deliver superior products at reduced cost. Android provided us so much built-in functionality, like WiFi and touchscreen, and it both simplified and accelerated the development of an advanced user interface. Of course, the benchtop oven is a relatively simple application, but we already are planning on using Android for future generations of more advanced equipment that will be monitored and controlled remotely from mobile devices.”

To learn more about the Android-based MC-301 Benchtop Reflow Oven from Manncorp, please go to http://www.manncorp.com/mc-301-benchtop-reflow.

High-Precision, High-Mix, Print-Place-Reflow Package Under $47K

From Manncorp

01/28/2014
Turnkey SMT assembly line
SMT turnkey assembly systems, reconfigured and expanded to accommodate a wider range of production levels and budgets.
Manncorp has recently reconfigured and expanded its exclusive selection of SMT turnkey packages, including stencil printers, pick and place machines, and reflow ovens, to accommodate a wider range of production levels and budgets. Among the ten different turnkeys presented on their website at www.manncorp.com/turnkeys is the new 2500-MV package. Priced at only $46,995, the 2500-MV is designed for companies with a limited budget and minimal floor space who need short-run, in-house production capability for ultra-precise, high component-mix SMT assembly.
The cornerstone of the 2500-MV is the MC-400 pick and place system, featuring Cognex® on-the-fly and bottom vision alignment, for high-accuracy, 2500 CPH placement of a wide range of advanced SMDs—from 0201 chip components to BGAs and 15 mil ultra-fine-pitch devices. The MC-400 has the capacity for up to 64 automatic “smart” tape feeders and can also accept a wide variety of stick, cut-strip, and IC tray holders. Built upon the same architecture as Manncorp’s popular MC Series of SMT pick and place machines, MC-400 feeders and software are compatible with all other MC series equipment.
The 2500-MV includes the heavy-duty MC-110 stencil printer —the industry’s most robust, highest-precision, manual printer with a repeatability of ±0.02 mm (less than 1 mil). Its universal mounting bracket allows clamping or screw mounting of frames up to 740 mm x 740 mm (29” x 29”) and tool-free, self-locking, X-Y-Z and theta axis adjustments provide quick and easy stencil to pad alignment.
The profilable MC-301 batch reflow oven rounds out the 2500-MV and simulates the performance of an inline system in a compact benchtop design. Through its innovative user interface and Android operating system, preheat, soak, reflow, and cooling stages are easily programmed to conform to component and paste manufacturer’s precise specifications. For process control and traceability, solder profiles are easily saved and distributed via built-in WiFi.
To learn more about the 2500-MV or other SMT turnkey systems available from Manncorp, please go to www.manncorp.com/turnkeys.

Profilable Benchtop Reflow Oven - Simulate Inline Ovens w/ Preheat, Soak, Reflow, & Cooling

Posted by Manncorp

Match your solder paste manufacturers’ precise specifications for preheat, soak, reflow, and cooling with the MC-301 Batch Reflow Oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC-301 is ideal for product development, prototyping, and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC-301’s exclusive hardware control app and Android operating system. Android architecture also allows users to take advantage of touch screen operation and integrated wireless networking for data transfer.

MC-301 Profilable Benchtop Reflow Oven SMT assembly equipment line

Manncorp CR Series Reflow Ovens for Every Reflow Soldering Application

Posted by Manncorp

Lead-free CR series SMT reflow ovens are designed for the mid-volume assembler with limited space requirements. Shorter heating tunnels lead to shorter overall system length without sacrificing performance, process width or features. In fact, CR series full-convection reflow ovens offer the best cost/performance ratio available.

CR series reflow oven
CR series reflow oven


For more information, please visit the website: Manncorp Lead-free CR series convection reflow ovens

Manncorp CR-4000C Reflow Oven

Posted by Manncorp

CR-4000C Reflow OvenThe CR-4000C reflow oven is a perfect fit for those assemblers who want a compact medium-volume lead-free reflow with many of the profiling and performance characteristics of larger ovens. Their obvious choice should be the CR-4000C because except for size, energy usage and price – which are much lower -- it matches many big oven assets feature for feature. It has a combination stainless steel mesh belt & pin conveyor with a board-heating width of 500 mm (20") and a double-sided board processing capability. Also part of the package is an on-board computer with Windows®-based password-protected software to permit on-screen profiling that sets oven parameters automatically. All this in a space-saving length of just over 6 ½ ft. The 4000C is a very green machine, consuming just 5 to 8 KW of electricity -- even when ramped up to lead-free temperatures of up to 300°C. Included are four independently controlled zones of high mass heating panels with two bottom-side convection zones spanning a total heating length of 1040mm (41") circulated by forced hot-air convection utilizing high-speed blowers. Three thermocouple inputs are provided for advanced temperature profiling and thermal management functions.

Manncorp CR-4000T Reflow Oven

Posted by Manncorp

Manncorp CR4000T Reflow Oven: two lower convection zones, stainless steel mesh conveyor accommodates PCBs up to 500 mm (20") wide, full-color touch-screen LCD display, just over 6 1/2 ft. long.



For more information, please visit the website: Manncorp CR4000T Reflow Oven

SMT Reflow Oven

Posted by Manncorp

A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCB). Manncorp multi-zone CR Series SMT reflow oven are available for both conventional and lead-free solders. They are designed and built to the highest standards while attaining excellent cost/performance ratio. Models shown include KIC's Auto Focus Power Software. (CR-4000T excluded.)



For more information, please visit the website: Manncorp reflow oven

Computer-Controlled Batch Reflow With Real-Time Profiling Mimcs Inline Reflow

Posted by Manncorp

BT300CP is a lead-free-capable batch reflow oven that takes up little more than 27
BT300CP is a lead-free-capable batch reflow oven that takes up little more than 27" x 22" of table space.
Electronics assemblers who need to produce prototypes, pre-production boards and other small batch/short-run jobs in-house can now get inline reflow results in a small footprint, at an affordable price-now with full computer control.

Manncorp’s BT300CP batch reflow oven has been upgraded to full computer control and now includes a laptop computer for convenient programming and program retrieval, oven operation, real-time display of actual board or oven temperatures, and process data storage and printing.

This benchtop reflow oven's ability to set as many as 40 sequential temperature points allows the temperature curves of solder paste manufacturer recommendations to be accurately reproduced, much the way an inline oven would. This not only produces production-level results but also simplifies the transition from prototyping/small batch production to full production.

BT300CP is a lead-free-capable batch reflow oven that takes up little more than 27" x 22" of table space. It ships directly from San Diego, California, comes with a 2-year parts warranty, and full software support is provided by Manncorp techs in the USA.

The BT300 series is also available as a nitrogen-ready oven (model BT300NCP).

Learn more and access pricing on the BT300CP, or contact sales@manncorp.com to discuss your unique reflow requirements.

Manncorp CR-8000/CR-10000 SMT Reflow Ovens

Posted by Manncorp

Manncorp 8-Zone CR-8000 and 10-Zone CR-10000 Reflow Soldering Ovens include a combination 570 mm (22.4") stainless steel mesh conveyor and adjustable pin-type conveyor for PCBs up to 450 mm (17.7") wide, feature a proprietary combination of high mass heat sources and efficient thermal heat transfer.


Customers may also be interested in Manncorp Mid-Hi Volume Reflow Ovens and Low Volume Reflow Soldering Ovens

For more information, please visit the website: Manncorp SMT Reflow Station

Manncorp SMT Reflow Soldering Ovens: Lead-Free Mid to High Volume Production Soldering Ovens from $18,995

Posted by Manncorp

CR Series Reflow Ovens for Every Reflow Soldering Application
Manncorp multi-zone CR Series SMT reflow soldering ovens are available for both conventional and lead-free solders. They are designed and built to the highest standards while attaining excellent cost/performance ratio. Models shown include KIC's Auto Focus Power Software. (CR-4000T excluded)


For more information, please visit the website: Manncorp Convection Reflow Ovens

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