Android(TM) Operating System Controls New Benchtop Reflow Oven

Posted by Manncorp

Android(TM) Operating System Controls New Benchtop Reflow Oven

An innovative Android-based operating system and high-resolution touchscreen user interface only begin to explain why Manncorp’s new MC-301 Benchtop Reflow Oven is among its hottest new products for 2014. By simulating the environment of an inline reflow system in a small footprint, the MC-301 is ideal for prototyping, manufacturability testing, and even short-run batch production. Its exclusive Android control app allows surface mount assemblers and product developers to meet solder paste manufacturers’ precise specifications for the preheat, soak, reflow, and cooling phases of their recommended profiles. Heating and cooling rates in each stage are also automatically calculated to easily verify compliance with component and material requirements.

The system includes an internal thermocouple that can be used to measure and record actual temperatures at strategic locations on the PCB while soldering. In the advanced mode, real-time feedback from the thermocouple can be used to control heater power and to establish optimal temperature settings for various applications. Android architecture allows users to easily save, store, and transfer recorded data and process parameters conveniently across networks via integrated WiFi.

Unlike other batch reflow ovens, the MC-301 heating chamber is divided into multiple heating zones; each one assigned to its own channel of the temperature control system. This advanced design eliminates thermal gradients within the oven and ensures minimal delta-T (±2 °C) across its 10" x 8" working area. Rapid cooldown is achieved with the aid of high-efficiency intake fans that draw air through the bottom of the unit and out through the 3" exhaust port at the top rear. Measuring only 27" x 19" x 11" and weighing in at less than 100 lbs., the MC-301 is an excellent choice for labs, schools, small production facilities, or other installations where space is often at a premium.

“The Android platform is the perfect fit for the MC-301,” says Manncorp President, Henry Mann, “because it’s so consistent with our objective to utilize cutting-edge technology to deliver superior products at reduced cost. Android provided us so much built-in functionality, like WiFi and touchscreen, and it both simplified and accelerated the development of an advanced user interface. Of course, the benchtop oven is a relatively simple application, but we already are planning on using Android for future generations of more advanced equipment that will be monitored and controlled remotely from mobile devices.”

To learn more about the Android-based MC-301 Benchtop Reflow Oven from Manncorp, please go to http://www.manncorp.com/mc-301-benchtop-reflow.

MANNCORP APEX Preview - Booth #2070

Posted by Manncorp

Profilable Benchtop Reflow Oven - Simulate Inline Ovens w/ Preheat, Soak, Reflow, & Cooling

Posted by Manncorp

Match your solder paste manufacturers’ precise specifications for preheat, soak, reflow, and cooling with the MC-301 Batch Reflow Oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC-301 is ideal for product development, prototyping, and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC-301’s exclusive hardware control app and Android operating system. Android architecture also allows users to take advantage of touch screen operation and integrated wireless networking for data transfer.

Solder Oven TWS-850 Manncorp Tutorial 3

Posted by Manncorp

Tutorial 3 for the Southern Polytech State University ECET department Manncorp Pick and Place lab. This tutorial shows you how to set up the Manncorp TWS-850 solder reflow oven.

Free Shipping on Benchtop Reflow Oven Anywhere in the USA. Today & Tomorrow Only - November 27th and November 28th, 2012

Posted by Manncorp

Computer-Controlled Batch Reflow With Real-Time Profiling Mimcs Inline Reflow

Posted by Manncorp

BT300CP is a lead-free-capable batch reflow oven that takes up little more than 27" x 22" of table space.

Electronics assemblers who need to produce prototypes, pre-production boards and other small batch/short-run jobs in-house can now get inline reflow results in a small footprint, at an affordable price-now with full computer control.

Manncorp’s BT300CP batch reflow oven has been upgraded to full computer control and now includes a laptop computer for convenient programming and program retrieval, oven operation, real-time display of actual board or oven temperatures, and process data storage and printing.

This benchtop reflow oven's ability to set as many as 40 sequential temperature points allows the temperature curves of solder paste manufacturer recommendations to be accurately reproduced, much the way an inline oven would. This not only produces production-level results but also simplifies the transition from prototyping/small batch production to full production.

BT300CP is a lead-free-capable batch reflow oven that takes up little more than 27" x 22" of table space. It ships directly from San Diego, California, comes with a 2-year parts warranty, and full software support is provided by Manncorp techs in the USA.

The BT300 series is also available as a nitrogen-ready oven (model BT300NCP).

Learn more and access pricing on the BT300CP, or contact sales@manncorp.com to discuss your unique reflow requirements.

Manncorp CR-4000T Reflow Oven

Posted by Manncorp

Manncorp CR-4000T Reflow Oven: The Industry's Most Affordable In-Line Hot-Air Convection Reflow Oven for Mid-Volume Lead-Free Soldering

Customers may also be interested in Manncorp Convection Reflow Oven and Benchtop Reflow Oven.

For more information, please visit the website: Manncorp Reflow Soldering Oven for Every Soldering Application

Manncorp CR-6000 Reflow Ovens for Reflow Soldering Application

Posted by Manncorp

Manncorp CR-6000 Reflow Soldering Oven comes standard with 6 full zones of hot-air convection heating, each with independent upper and lower temperature controls, a combination adjustable edge-pin/stainless steel mesh belt conveyor, three thermocouple inputs, and a computer controller with a user-friendly Windows-based operating system for precision temperature profiling.

Customers may also be interested in Manncorp Convection Reflow Oven and Benchtop Reflow Oven

For more information, please visit the website: Manncorp Reflow Ovens for Every Reflow Soldering Application.

Manncorp BT300CP Lead-Free Batch Reflow Oven

Posted by Manncorp

Manncorp BT300CP lead-free batch reflow oven simulates large reflow soldering oven profiling with your laptop, PCB up to 9” x 14”

For more information, please visit the website: Manncorp Direct

Manncorp Benchtop Reflow Oven

Customers interested in purchasing benchtop reflow oven systems can contact Manncorp and customer service representatives will provide rapid quotes and customized printable pricing information for budget analysis, management review or comparative pricing. Manncorp is also able to assist with detailed technical data, convenient sales consultation, on-site training by Manncorp's own factory-trained technicians, annual maintenance of the benchtop reflow oven equipment and a one year warranty for each system and product purchased. Each benchtop reflow oven system purchased is backed by the Manncorp name and its proud record as a leading provider of electronic equipment since 1967.

The people of Manncorp look forward to working with customers of the benchtop reflow oven equipment who will quickly discover that Manncorp is operated with the principles and ethics adhered to during its forty years of doing business. Whether a customer requires equipment for prototyping, short runs, or medium to high volume production, there is a Manncorp benchtop SMT system to deliver the flexibility and ease of use that allows quick setup and changeover from one application to another. Single and multiple placement head configurations, solder paste and adhesive dispensing capability, and an adjustable three-stage conveyor are just a few available options that allow users to configure Manncorp SMT systems to meet specific needs. Manncorp benchtop SMT equipment is specially designed to provide the highest levels of versatility and performance required to meet any surface mount assembly and the Manncorp benchtop batch reflow oven systems have been specifically designed for low volume lead-free batch reflow soldering.

Manncorp also offers a full line of benchtop reflow oven systems for lead-free batch reflow soldering of PCBs up to 400 mm (15.75" x 15.75") with multi-stage heating and options, such as PC controlled profiling and nitrogen blanketing with PPM-02 monitoring. The Manncorp benchtop reflow oven 850 features a single chamber with hot air convection reflow for lead-free soldering. This model can handle PCBs up to 330mm x 240mm and has dual stage heating to 260 degrees C. The benchtop reflow oven provided by Manncorp has a hotbake function for fine pitch drying and LCD Touchscreen control and 02 monitor. Manncorp also offers the 998LF benchtop reflow oven which is a low-cost combination/ convection heating for lead-free soldering. The 998LF features a low air turbulence design, no component shifting and is available in 4 PCB size capacities. The Manncorp benchtop reflow oven also features dual stage heating to 260 degrees C, a low power consumption, a quick start-up and a membrane keypad w/LED display.