BGA Rework System

Manncorp BR Series SMT Rework Systems with Split-Vision Alignment

Posted by Manncorp

Check out Manncorp BR Serie BGA rework stations (SMT rework systems) with split-vision alignment: for automatic removal, placement, and soldering of BGAs, CSPs, QFPs, and other advanced SMDs

Manncorp BR Series SMT Rework Systems with Split-Vision Alignment


For more information, please visit the website: Manncorp BR Series SMD Rework Stations with Split-Vision Alignment

Manncorp's Upated Split-Vision Rework System Now Automatically Places BGAs, CSPs, QFNs & PoPs

Posted by Mike Schwartz, Marketing Director of Manncorp

A rework station with higher-resolution split-vision for easier and more accurate alignment has been introduced by Manncorp. The lead-free system BR750, to be exhibited at Manncorp’s APEX booth #2907, also contains ultra-precise processing controls to meet the challenge of removal and placement of BGAs, CSPs, QFNs, PoPs and other subminiature surface mount devices.



A key to the system’s enhanced performance is its innovative heating, including independent and fully programmable top and bottom hot air, plus rapid on/off IR underheaters. The latter eliminates thermal tension that can damage boards or components adjacent to those being processed. With eight different set points, exact thermal conditions can be produced for profiles containing heating rate, target temperature, dwell time and cooling. The profiles are shown in real time on a convenient LCD display.

After entering their size, SMDs are automatically pre-aligned and picked up from the component nest at their exact centers. An upward-looking camera then verifies positioning at all four corners of each device, while split-vision optics and electronic zoom adjustment of up to 22x does the fine tuning. This procedure is said to be extremely efficient in handling rework involving removal and placement of the same components repeatedly. Added guidance comes from LED lighting that clearly projects superimposed images of component leads and PCB pads on a full color LCD display. The BR750 BGA rework system will handle PCBs up to 500mm x 550mm and component sizes from 1mm x 1mm to 60mm x 60mm.

“Our customers are most impressed with the advanced capabilities and performance of BR750 and equally amazed at its breakthrough price of only $19,995,” CEO Henry Mann stated. “By making quick work of desoldering, component removal, resoldering and placement, this machine will most assuredly prove to be a wise investment.” For details, access Manncorp BR750 BGA rework system, call 1.800.PIK MANN (745.6266) or e-mail sales@manncorp.com

Manncorp Planning To Exhibit Its Best Sellers at APEX

Posted by Mike Schwartz, Marketing Director of Manncorp

Apex visitors may get to see three products that helped drive Manncorp to record sales in 2011. They are the 5,000 cph MC-385 pick and place machine, the BR750 split-vision BGA rework system and the BT300CP lead-free batch reflow oven.

Manncorp MC-385 Pick and Place Machine

With a placement accuracy of 30 µm, 3 sigma and a price of under $50,000, the MC-385 pick and place machine has become a value and performance benchmark for mid-volume PCB assembly. The BR750 BGA rework system automatically removes and replaces BGAs, QFPs and other fine-pitch devices. It is priced at $19,995. The BT300CP computer-controlled bench-top reflow oven, at $3,995, features thermocouple-aided profiling, with forced hot air convection. Manncorp will be exhibiting in Booth #2907 at Apex 2012, San Diego, CA.

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