Check Out Our VP500X Vapor Phase Soldering Oven Video

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For more information, please visit the website: Manncorp VP500X Vapor Phase Reflow Oven

Manncorp to Unveil New Stencil Printer and Vapor Phase System at IPC APEX Expo 2013

Posted by Manncorp

Electronic manufacturing equipment provider Manncorp will be unveiling several all-new products at IPC APEX Expo Booth #118 in San Diego, California, February 19-21. Among the new products will be a compact, touchscreen-controlled vapor phase soldering system designed for the most complex, temperature-sensitive soldering and conductive adhesive curing applications. The batch-style system handles large PCBs and irregularly shaped assemblies up to 500 x 500 mm (20"x 20") and features a unique and highly efficient vapor recovery system for maximum ROI.





A new dual-squeegee semiautomatic programmable stencil printer with dual CCD cameras for vision-assisted alignment will also be introduced. Microprocessor control of print stroke, print speed, squeegee pressure and vertical snap-off speed and distance allow ultrafine-resolution printing for the smallest 01005 and 0201 chip components, fine-pitch QFPs and BGAs. The system features a large 480 x 400 mm (19” x 15.75”) print area and pneumatic stencil frame clamping for quick changeovers.





Also at the show will be the new Sherlock-300F benchtop AOI system, a radical redesign of desktop AOI featuring an iPad®-like multi-touch interface for programming and operation and a drawerless design where the PCB is transported through the machine on a conveyor for faster loading and unloading. Enjoy full defect coverage with low false call rates at an affordable price.





MC-400 automated benchtop pick & place brings a new level of accuracy and reliability to prototyping and low- to medium-volume production. MC-400 places 0201s through 100 x 150 mm components at rates to 3,000 pph with ±0.05 mm (0.002") placement accuracy. Dependable, user-proven software provides fast, simple setup and operation, even for complex surface mount assemblies.





One of Manncorp's popular ULTRA-DRY desiccant dry cabinets, which provide humidity-controlled storage for moisture-sensitive devices (MSDs) to protect against moisture-related defects and costly product failures, will also be available on the APEX show floor.





Stop by Booth #118 to get a first look at the latest products from Manncorp designed to improve the quality and reliability of printed circuit board assemblies. www.manncorp.com/smt

Manncorp VP260 High Throughput Vapor Phase Soldering System

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Manncorp VP260 High Throughput Vapor Phase Oven. Front-Loading Two-Chamber Vapor Phase Does Lead or Lead-Free Automatic Soldering

For more information, please visit the website: Manncorp VP260 Vapor Phase Oven

Manncorp ML100 Vapor Phase Oven

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Manncorp ML100 Vapor Phase Oven: Vapor Phase Soldering System For Labs, Prototyping & Low-Volume Production

For more information, please visit the website: Manncorp ML100 Vapor Phase Soldering Oven

Advantages & Benefits of Vapor Phase Soldering System

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The precise, defect-free characteristics of vapor phase have made it the soldering choice for military, aerospace and medical equipment applications.

Lead-free and tin/lead solders may be used interchangeably by simply changing the vapor phase fluid. The only adjustment is setting the process temperature in relation to the boiling point of the fluid used. For lead-free processing, fluids are available with high boiling points up to 260°C. For tin/lead soldering, fluids with lower boiling points are also available.

Vapor phase fluid chosen is also based on solder paste being used. There are fluids for every paste and the same formula fluid will provide consistent results.

Heat transfer coefficient of vapor phase is approximately 10x faster than hot air and 8x faster than IR heat.

Vapor phase oven takes place at only 5°C to 10°C over the melting point of solder paste. Other reflow methods require 30°C to 35°C for the same task due to their lower heat transfer rates. Lower soldering temperatures means less component stress, no delamination or popcorning.

There is no need for a nitrogen atmosphere in vapor phase oven, since the vapor condensate covers every component in the assembly. The entire atmosphere of the chamber itself is chemically inert with zero oxygen content without the need for nitrogen. The process thus provides an atmosphere for better wetting characteristics.

Assemblies cannot be overheated, since the boiling point of the heat transfer fluid is almost identical to the process temperature. The lower temperature vapor phase and even heat transfer ensure lower thermal stress and prevention of component "tombstoning".

Vapor phase oven is energy efficient and maintenance costs are significantly lower in comparison to radiation and convection soldering technologies. Heat transfer fluids are non-toxic and environmentally safe. They are non-corrosive, chemically inert, and do not contain CFCs.

Manncorp's small-footprint vapor phase ovens occupy almost 50% less floor space than other conveyorized soldering equipment.

Vapor Phase oven maintains consistent actual temperature, regardless of the size, shape or surface area of the PCB. Every component will likewise maintain the identical temperature, regardless of its size, density or location.

Manncorp Vapor Phase Ovens VP260 and ML100

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Manncorp vapor phase ovens VP260 and ML100. Produce perfectly soldered boards consistently with vapor phase.

For more information, please visit the website: Manncorp Vapor Phase Ovens