Dip soldering
Latest Soldering Equipment
Posted by Manncorp
MC-301N Nitrogen Benchtop/Batch Reflow Oven
Nitrogen, Profilable Batch Reflow Oven w/ Android™ OS. Match your solder paste manufacturers’ precise specifications for preheat, soak, reflow, and cooling with the MC-301N Nitrogen Batch Reflow Oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC-301N is ideal for product development, prototyping, and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC-301N’s exclusive hardware control app and Android operating system. Android architecture also allows users to take advantage of touch screen operation and integrated wireless networking for data transfer. Connection for nitrogen input and integrated flow controller included.
CR-4000C Full Convection SMT Reflow Oven
Compact, Affordable Lead-Free Reflow Soldering Oven with Combination Mesh Belt & Pin Conveyor. The CR-4000C is a perfect fit for those assemblers who want a compact medium-volume lead-free reflow with many of the profiling and performance characteristics of larger ovens.
Auto-Dip 6035-TS Programmable Dip Soldering System with Touch-Screen for Large PCBs
The fully programmable, touch-screen controlled Auto-Dip 6035-TS includes all the same features as the Auto-Dip 3530-TS, but has larger fixture-less and finger-type board holders that can handle oversized PCBs or pallets to 600 x 350 mm (23.6" x 13.8"). Like the 3530 models, the 6035-TS includes a titanium solder pot and digital PID temperature control for the full range of lead-free SAC or SnPb solders. All Auto-Dip dip soldering systems include an automatic dross skimmer and collection trough, multi-day automatic startup, foot pedal actuation, and a heavy-duty mounting stand. An optional spray fluxing unit is also available.
ULTIMA TR2 Benchtop Selective Soldering Machine
The unique and innovative design of the ULTIMA TR2 selective soldering machine brings features and performance to the benchtop that, until now, could only be found in equipment twice the size and twice the cost. The TR2 includes a high-precision PCB handling system fully programmable in the X, Y, and Z axes, a compact solder pot and pump assembly with extremely responsive, programmable flow control, and a wave nozzle with integral nitrogen preheat; features that guarantee fast, consistent, high-quality soldering of through-hole components to SMT boards.
C350 Lead-Free Wave Solder Machine
Low Solder Costs & Reduced Energy Consumption in an Affordable Low-to-Medium Volume Wave Soldering System. Having a solder capacity of just 150 kg (approximate weight for lead free solder), this machine will run almost 2/3 less than larger-pot systems in start up costs. Model C350 is geared toward low to mid-volume assemblers who don't have the space or budget for a full size system but require lead-free soldering capability for through-hole-only or through-hole, surface mount and mixed technology jobs. It's also ideal for precision low-volume applications. The C350 wave solder machine handles full-sized PCB assemblies up to 350 mm (13.8") wide in its fully adjustable, corrosion-resistant, fiber-finger conveyor and includes an IR preheater, foam fluxer and touch-panel PLC controller with weekly timer for automatic startup and shutdown.
ULTIMA NEO-L All-in-One Selective Soldering System
High-precision selective fluxing and soldering of through-hole parts to SMD assemblies. The ULTIMA NEO-L combines high-precision selective flux application with fully programmable point-to-point or continuous linear soldering to produce an all-in-one, turnkey solution for soldering through-hole components and connectors to SMT boards.
MC-301 Benchtop/Batch Reflow Oven
Profilable Batch Reflow Oven w/ Android™ Operating System. Match your solder paste manufacturers’ precise specifications for preheat, soak, reflow, and cooling with the MC-301 Batch Reflow Oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC-301 is ideal for product development, prototyping, and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC-301’s exclusive hardware control app and Android operating system. Android architecture also allows users to take advantage of touch screen operation and integrated wireless networking for data transfer.
28.400 Compact Wave Soldering Machine
Affordable Dual-Wave Soldering System for Medium- to High-Volume Production. Designed for budget conscious assemblers with intermediate to heavy throughput requirements, Model 28.400 wave solder machine comes standard with a number of advanced features. The wave solder system features an auto-cleaning titanium finger conveyor with motorized width adjustment that handles PCBs up to 15.75" (400 mm) wide. The internal, automatic spray fluxing system includes a precision, low-pressure atomizer. The highly stable, 4.2' (1300 mm) convection preheater activates fluxes while prepping the assembly for soldering temperatures. The 28.400 wave soldering equipment also includes a high-capacity 370 kg (816 lbs. approximate weight for lead free solder), lead-free-ready titanium-alloy solder pot and color LCD touch-panel control, with all parts backed by a one-year warranty.
Improved Dip Soldering Systems Have Wider Range of Capability
Posted by Manncorp
05/13/2014
While dip soldering of through-hole components has long been an easy and affordable way to automate manual soldering processes when the costs of wave soldering cannot be justified, these latest enhancements increase quality and repeatability to a degree that make Auto-Dip systems ideal for virtually any short-run, batch application.
New models of Manncorp’s popular Auto-Dip series include features that take dip soldering technology to new levels of performance and reliability. While dip soldering of through-hole components has long been an easy and affordable way to automate manual soldering processes when the costs of wave soldering cannot be justified, these latest enhancements increase quality and repeatability to a degree that make Auto-Dip systems ideal for virtually any short-run, batch application. Due to their quick setup time and ease of use, Auto-Dip systems fill an important role and are a valuable addition to electronic manufacturing facilities of any scale.
Most significantly, touch-screen controlled Auto-Dip models feature programmable preheat and dip height settings and include an adjustable, finger-type PCB holder that firmly grips the edges of the board throughout the soldering cycle. This flexible design is especially useful for heavy component-laden assemblies and can also accept customized pallets of very small, irregularly-shaped PCBs. Programmable speed, dip angle, lift angle, and dwell time provide a high degree of process control that ensures consistent, high-quality solder joints. An interchangeable version of the popular, pin-type PCB holder is also included which allows simultaneous soldering of multiple PCBs, randomly placed on the fixture-less, “bed-of-nails” loading platform.
Starting at $7,995, all Auto-Dip models have titanium solder pots with high-precision temperature controllers for use with lead-free SAC or SnPb solders. They also include an automatic dross skimmer and collection trough, and a programmable, 7-day, 24-hour startup timer. The largest model can handle large PCBs up to 600 x 350 mm (23.6" x 13.8") and its 100 Kg solder pot is still less than half the capacity of most small wave soldering systems and further lowering the comparative startup costs. A heavy-duty, steel mounting stand with leveling feet is also included for sturdy, safe installation.
The EZ-Flux 500A spray fluxing system is a handy accessory to the Auto-Dip systems and keeps the production area clean and residue-free. Foot-pedal activation frees the operator's hands for manipulating the PCB over the flux nozzle which includes separate adjustments for flow volume and mist density. Shields on the top of the unit are adjusted according to the PCB dimensions to minimize overspray and to recover excess flux.
To learn more about the Auto-Dip Series of dip soldering systems and accessories from Manncorp, please go to http://www.manncorp.com/Auto-Dip.html.
Manncorp Benchtop Wave Solder Machines
Posted by Manncorp
We have three different kinds of benchtop wave solder machines
BW350 Bench-Top Wave Machine
Uses Less Solder & Energy; Occupies Fraction of Larger Systems’ Space
Manncorp 2100T Auto-Dip Soldering Machine
Fast, Efficient, and Reliable Alternative to Manual Lead-Free Soldering
Manncorp 120 Mini Wave Solder Machine
Lead-Free Mini Wave Machine is Ideal for Selective Soldering Applications
For more information, please visit the website: Manncorp Benchtop Wave Solder Machines