November 2012
The Latest in Affordable Protection for Moisture-Sensitive Devices. Ultra-Dry Cabinets are in Stock, Ready to Ship and Available for Purchase Online
Thursday, November 15, 2012 Desiccant Dry Cabinets, desiccator cabinets, dry box, dry box for electronic components, dry box for electronics, dry cabinets 0
Posted by Manncorp
The latest in affordable protection for moisture-sensitive devices. Ultra-Dry cabinets are in stock, ready to ship and available for purchase online.
Even with resealable moisture barrier bags (MBBs), moisture damage is still a risk. Torn or improperly sealed MBBs expose moisture-sensitive devices to ambient humidity. When these devices are subjected to reflow temperatures, the moisture expands, causing microcracking and other very difficult to detect damage. Costly failures in the field are often the result.
Eliminate the risks—along with the hassle of dealing with humidity indicator cards (HICs) and desiccant bags—with Ultra-Dry desiccant dry cabinets from Manncorp Direct, six sizes of which are available for online purchase and immediate shipment.
Humidity-controlled Ultra-Dry desiccant dry cabinets protect components in tapes, tubes, reels, trays, unsealed moisture barrier bags (MBBs) or loaded tape feeders. They can also be used to protect multilayer and class 3 product bare boards, partially assembled boards, and moisture-sensitive plastics and films.
Ultra-Dry desiccant dry cabinets feature self-replenishing desiccant—no need to ever replace or refill it—with airtight magnetic sealers, compression handles, and anti-static paint and glass. Turbo dryer, included as standard on every model, ensures an RH atmosphere of =5%—significantly lower than specified by IPC/JEDEC J-STD-033C. All desiccant dry cabinets feature adjustable shelves. Rolling models include anti-static locking wheels.
For easy, reliable protection of moisture-sensitive devices, purchase an Ultra-Dry desiccant dry cabinets online at www.manncorpdirect.com —in stock and ready to ship.
Precision, Flexibility and Ease of Use. A Benchtop Pick and Place for Startups and Low-to-medium-volume Assemblers
Tuesday, November 13, 2012 benchtop pick and place machine, cheap pick and place machine, desktop pick and place machine, low cost pick and place machine, pick and place machine, tabletop pick and place machine 0
Posted by Manncorp
For more information, please visit the website: Manncorp FVX Benchtop Pick and Place Machine
Manncorp Direct Dry Boxes Protect Against Costly Moisture-Related Defects
Friday, November 9, 2012 desiccant dry box, Desiccant Dry Cabinet, dry boxes, dry cabinets, electronics dry box 0
Posted by Manncorp
Manncorp Direct dry cabinets protect against costly moisture-related defects.
For more information, please visit the website: Manncorp Direct Desiccant Dry Boxes
Sherlock-300 Series AOI Systems with Multi-Touch Screen Control
Wednesday, November 7, 2012 automated optical inspection, Automated Optical Inspection (AOI) machine, Automated Optical Inspection (AOI) System, Automated Optical Inspection (AOI) System Prices, PCB AOI 0
Posted by Manncorp
Sherlock-300 series of automated optical inspection (AOI) systems provide excellent defect coverage, average cycle times of 10 seconds per board* (including transport), low false call and false accept rates (FCR and FAR) for a wide range of production environments. All three models—benchtop, inline and batch—feature as standard fast multi-touch touchscreen control.
For more information, please visit the website: Manncorp Automated Optical Inspection (AOI) Systems for PCB
Manncorp CR-4000C Reflow Oven
Monday, November 5, 2012 reflow oven, reflow soldering oven, SMT reflow oven, solder reflow oven 0
Posted by Manncorp
The CR-4000C reflow oven is a perfect fit for those assemblers who want a compact medium-volume lead-free reflow with many of the profiling and performance characteristics of larger ovens. Their obvious choice should be the CR-4000C because except for size, energy usage and price – which are much lower -- it matches many big oven assets feature for feature. It has a combination stainless steel mesh belt & pin conveyor with a board-heating width of 500 mm (20") and a double-sided board processing capability. Also part of the package is an on-board computer with Windows®-based password-protected software to permit on-screen profiling that sets oven parameters automatically. All this in a space-saving length of just over 6 ½ ft. The 4000C is a very green machine, consuming just 5 to 8 KW of electricity -- even when ramped up to lead-free temperatures of up to 300°C. Included are four independently controlled zones of high mass heating panels with two bottom-side convection zones spanning a total heating length of 1040mm (41") circulated by forced hot-air convection utilizing high-speed blowers. Three thermocouple inputs are provided for advanced temperature profiling and thermal management functions.
Solder Tips from ACI Technologies
Thursday, November 1, 2012 ACI Technologies, solder tips 0
Flip Chip Assembly
The intense competition in the electronics industry generally serves to drive down the size and cost of electronic products while improving their performance, flexibility, and reliability. As a part of this effort, packaging methods are constantly being improved and new, innovative methods are being developed. One area of focus is highly integrated chip-level electronics assembly, using multiple unpackaged dies and electrical components in a single package. One of the most popular methods is known as flip chip assembly.
Flip chip microelectronic assembly is the direct electrical connection of face-down, or flipped electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip input/output (I/O) pads. In contrast, wire bonding uses face-up chips with a wire connection to each pad (Figure 1-1). Flip chip components are predominantly semiconductor devices; however, components such as passive filters, detector arrays, and microelectromechanical systems (MEMS) devices are also used in flip chip form. IBM still uses the flip chip interconnection that they introduced in the early sixties for their mainframe computers. The assembly process has proliferated in many other applications, including automotive electronics, smart cards, radio frequency identification (RFID) cards, electronic watches, cell phones, and high speed microprocessors.
Figure 1-1: Wire bond versus flip chip |
There are three stages in making flip chip assemblies: bumping the die or wafer, attaching the bumped die to the board or substrate, and in most cases, filling the remaining space under the die with an electrically non-conductive material. The conductive bump, the attachment materials, and the processes used differentiate the various kinds of flip chip assemblies. The most common bumping and attaching methods include solder bump, plated bump, stud bump, and adhesive bump. The bump serves several functions in the flip chip assembly. Electrically, the bump provides the conductive path from chip to substrate. The bump also provides a thermally conductive path to carry heat from the chip to the substrate. In addition, the bump provides part of the mechanical mounting of the die to the substrate. Finally, the bump provides a spacer, preventing electrical contact between the chip and substrate conductors, and acting as a short lead to relieve mechanical strain between board and substrate.
The cost, performance, and space constraints of the application determine which method is the most suitable. A current EMPF project is focused on the development of a silicon germanium (SiGe) System on a Chip (SoC), assembled in a Flip Chip on Board (FCoB) configuration. For SiGe applications, stud bump bonding is considered to be one of the most robust packaging options given the process restrictions. The balance of this article reviews some of the more common bump attachment methods.
Solder Bump Flip Chip
The solder bumping process first requires that an under bump metallization (UBM) be applied to the aluminum chip bond pads, typically by sputtering or plating to remove the insulating oxide layer and to define the solderable area. Solder is deposited (Figure 1-2) on the UBM by needle-depositing or screen printing solder paste, evaporation, or electroplating. After solder bumping, the wafer is cut into bumped die. The bumped dies are placed on the substrate pads, and the assembly is heated to make a solder connection.
Figure 1-2: Solder balls. |
Stud Bump Flip Chip
The gold stud bump flip chip process, bumps die by a modified standard wire bonding technique. This technique makes a gold ball for wire bonding by melting the end of a gold wire to form a sphere. The gold ball is attached to the chip bond pad as the first part of a wire bond. To form gold bumps instead of wire bonds, modified wire bonders break off the wire after attaching the ball to the chip bond pad. The gold stud bump remaining on the bond pad provides a permanent connection through the aluminum oxide to the underlying metal. Gold stud bump flip chips may be attached to the substrate bond pads with conductive adhesive (Figure 1-3) or by thermosonic gold-to-gold connection.
Figure 1-3: Double stud bump attached with conductive epoxy. |
Plated Bump Flip Chip
Plated bump flip chip uses wet chemical processes to remove the insulating oxide layer and plate conductive metal bumps onto the wafer's aluminum bond pads. In general, plated nickel-gold bumps are formed on the semiconductor wafer by electroless nickel plating of the aluminum bond pads of the chips. After plating the desired thickness of nickel, an immersion gold layer is added for protection, and the wafer is cut into bumped die. Alternatively, silver bumps are electroplated on a sputter seeded semiconductor wafer (Figure 1-4). Attachment generally is by solder or adhesive, which may be applied to the bumps or the substrate bond pads by various techniques.
Figure 1-4: Silver plated bumps. |
Adhesive or Polymer Bump Flip Chip
The polymer bump process is a patented, stencil printing technology in which isotropically conductive, silver filled polymers are printed through metal stencils to form polymer bumps on a zincate-nickel gold, electroless plated UBM that covers the aluminum bond pads of the semiconductor die. The polymers are either thermoset which cures with heat, or thermoplastic which softens with heat. These silver-filled polymers are formulated for high precision stencil printing through laser etched or electroformed metal stencils. Once the bumped wafers are diced, the chips are inverted and bonded to the substrate. Final processing involves a heat cure for the thermoset bumps while the thermoplastic bump connections are made in a few seconds as heat and pressure are used to melt the thermoplastic.
Flip Chip Underfill
As described above, one function of the bump is to provide a space between the chip and the board. In the final stage of assembly, this under-chip space is usually filled with a non-conductive "underfill" adhesive joining the entire surface of the chip to the substrate.
The underfill protects the bumps from moisture or other environmental hazards, and provides additional mechanical strength to the assembly. However, its most important purpose is to compensate for any thermal expansion difference between the chip and the substrate. Underfill mechanically "locks together" chip and substrate so that differences in thermal expansion do not break or damage the electrical connection of the bumps.
Underfill may be needle-dispensed or jet-dispensed along the edges of each chip. It is drawn into the under-chip space by capillary action and heat-cured to form a permanent bond.
Conclusion
The methods covered in this article are only a few of the wide range of techniques used as part of the flip chip process. The development of new techniques is proceeding continually. Flip chip assembly has been shown to have significant advantages over other microelectronic packaging methods. Several varieties of flip chip assembly, including solder bump, plated bump, gold stud bump, and adhesive bump are suitable for a wide range of applications.
ACI Technologies, Inc.
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