Latest Soldering Equipment
Posted by Manncorp
MC-301N Nitrogen Benchtop/Batch Reflow Oven
Nitrogen, Profilable Batch Reflow Oven w/ Android™ OS. Match your solder paste manufacturers’ precise specifications for preheat, soak, reflow, and cooling with the MC-301N Nitrogen Batch Reflow Oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC-301N is ideal for product development, prototyping, and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC-301N’s exclusive hardware control app and Android operating system. Android architecture also allows users to take advantage of touch screen operation and integrated wireless networking for data transfer. Connection for nitrogen input and integrated flow controller included.
CR-4000C Full Convection SMT Reflow Oven
Compact, Affordable Lead-Free Reflow Soldering Oven with Combination Mesh Belt & Pin Conveyor. The CR-4000C is a perfect fit for those assemblers who want a compact medium-volume lead-free reflow with many of the profiling and performance characteristics of larger ovens.
Auto-Dip 6035-TS Programmable Dip Soldering System with Touch-Screen for Large PCBs
The fully programmable, touch-screen controlled Auto-Dip 6035-TS includes all the same features as the Auto-Dip 3530-TS, but has larger fixture-less and finger-type board holders that can handle oversized PCBs or pallets to 600 x 350 mm (23.6" x 13.8"). Like the 3530 models, the 6035-TS includes a titanium solder pot and digital PID temperature control for the full range of lead-free SAC or SnPb solders. All Auto-Dip dip soldering systems include an automatic dross skimmer and collection trough, multi-day automatic startup, foot pedal actuation, and a heavy-duty mounting stand. An optional spray fluxing unit is also available.
ULTIMA TR2 Benchtop Selective Soldering Machine
The unique and innovative design of the ULTIMA TR2 selective soldering machine brings features and performance to the benchtop that, until now, could only be found in equipment twice the size and twice the cost. The TR2 includes a high-precision PCB handling system fully programmable in the X, Y, and Z axes, a compact solder pot and pump assembly with extremely responsive, programmable flow control, and a wave nozzle with integral nitrogen preheat; features that guarantee fast, consistent, high-quality soldering of through-hole components to SMT boards.
C350 Lead-Free Wave Solder Machine
Low Solder Costs & Reduced Energy Consumption in an Affordable Low-to-Medium Volume Wave Soldering System. Having a solder capacity of just 150 kg (approximate weight for lead free solder), this machine will run almost 2/3 less than larger-pot systems in start up costs. Model C350 is geared toward low to mid-volume assemblers who don't have the space or budget for a full size system but require lead-free soldering capability for through-hole-only or through-hole, surface mount and mixed technology jobs. It's also ideal for precision low-volume applications. The C350 wave solder machine handles full-sized PCB assemblies up to 350 mm (13.8") wide in its fully adjustable, corrosion-resistant, fiber-finger conveyor and includes an IR preheater, foam fluxer and touch-panel PLC controller with weekly timer for automatic startup and shutdown.
ULTIMA NEO-L All-in-One Selective Soldering System
High-precision selective fluxing and soldering of through-hole parts to SMD assemblies. The ULTIMA NEO-L combines high-precision selective flux application with fully programmable point-to-point or continuous linear soldering to produce an all-in-one, turnkey solution for soldering through-hole components and connectors to SMT boards.
MC-301 Benchtop/Batch Reflow Oven
Profilable Batch Reflow Oven w/ Android™ Operating System. Match your solder paste manufacturers’ precise specifications for preheat, soak, reflow, and cooling with the MC-301 Batch Reflow Oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC-301 is ideal for product development, prototyping, and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC-301’s exclusive hardware control app and Android operating system. Android architecture also allows users to take advantage of touch screen operation and integrated wireless networking for data transfer.
28.400 Compact Wave Soldering Machine
Affordable Dual-Wave Soldering System for Medium- to High-Volume Production. Designed for budget conscious assemblers with intermediate to heavy throughput requirements, Model 28.400 wave solder machine comes standard with a number of advanced features. The wave solder system features an auto-cleaning titanium finger conveyor with motorized width adjustment that handles PCBs up to 15.75" (400 mm) wide. The internal, automatic spray fluxing system includes a precision, low-pressure atomizer. The highly stable, 4.2' (1300 mm) convection preheater activates fluxes while prepping the assembly for soldering temperatures. The 28.400 wave soldering equipment also includes a high-capacity 370 kg (816 lbs. approximate weight for lead free solder), lead-free-ready titanium-alloy solder pot and color LCD touch-panel control, with all parts backed by a one-year warranty.