November 2013

Profilable Benchtop Reflow Oven - Simulate Inline Ovens w/ Preheat, Soak, Reflow, & Cooling

Posted by Manncorp

Match your solder paste manufacturers’ precise specifications for preheat, soak, reflow, and cooling with the MC-301 Batch Reflow Oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC-301 is ideal for product development, prototyping, and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC-301’s exclusive hardware control app and Android operating system. Android architecture also allows users to take advantage of touch screen operation and integrated wireless networking for data transfer.

MC-301 Profilable Benchtop Reflow Oven SMT assembly equipment line

Newer Posts Older Posts