February 2013

BR720 BGA Rework Station Split-Vision Alignment for Automatic Removal, Placement, and Soldering of BGAs, CSPs, QFPs, and Other SMDs

Posted by Manncorp

The Manncorp BR720 is the industry's most affordable BGA rework station to feature split-vision optics, fully-programmable top and bottom heating, an integral thermocouple input, and a large-area multi-zone IR underheater — features essential for safe and reliable removal, placement, and soldering of BGAs, ultra-fine-pitch QFPs, and other challenging surface mount repairs. The split-vision optics and camera assembly is mounted to a precision X-Y slide mechanism that allows easy positioning between the component and the PCB.

BR720 BGA rework station

Easily Adjustable PCB Holder Accepts Boards Up To 550 mm x 500 mm (21.6" x 19.7")
The BR720's unique board holding system accommodates virtually any surface mount or mixed technology PCB assembly up to 550 mm x 500 mm (21.6" x 19.7"). A wide range of X- and Y-axis adjustability, combined with an innovative quick-release clamping mechanism, universal PCB support rails, and a moveable multi-zone IR underheater ensure that any application set-up can be optimized to take full advantage of all the BR720’s advanced features.
BR720 BGA Rework Station Easily Adjustable PCB Holder
X, Y, and Theta Axes Micrometer Adjustments for Precise Alignment of Component Leads to PCB Pads
Ultra-fine micrometers on the PCB holder for X- and Y- axes, and an additional one on the pick-up head for the theta axis, allow fast, easy, and precise alignment of the component leads to the PCB pads with the aid of high-resolution superimposed images of the board and the component projected through the Split-Vision Optics onto the LCD display.
BR720 BGA Rework Station X, Y, and Theta Axes Micrometer Adjustments
Innovative Laser Guide for Easy Alignment of Component Over Bottom Side Heater
Proper setup of the BR720 calls for alignment of the bottom heater, the component, and the top heater in the Z axis. Positioning the board in the PCB holder so that the component on the top side is positioned directly over the bottom heater nozzle is facilitated with a handy laser pointer that is attached to the upper heater and is targeted at the virtual center of the bottom heater. Positioning the component on the PCB below the laser spot ensures that the bottom heater, component, and upper heater are virtually aligned and reduces setup time.
BR720 BGA Rework Station Innovative Laser Guide
Split-Vision Optics Provide Superimposed Images of Leads and Pads for Precise Alignment
Split-Vision Optics, with electronic zoom and focus, and high-brightness adjustable LED lighting provide high-contrast superimposed images of the component leads (as it is being held on the placement head) and the pads on the PCB. The operator views this image on the BR720ís full color LCD display and if the component leads (which appear blue on the display) are misaligned with the pads on the PCB as shown in the upper image at left, the X-, Y-, and Theta axes micrometer adjustments can then be used to align the component and board as shown in the bottom image. Once the component leads and pads are aligned, precise placement is ensured.
BR720 BGA Rework Station Split-Vision Optics
Intuitive Touch-Screen Interface with One-Touch Operation and Parameter Adjustment On-the-Fly
The BR720 features an easy to use touch-screen interface with password protected user privileges that separate operator and administrative/programming functions. Operator controls allow one-touch functionality for desoldering operations with automatic placement and soldering also taking place at the touch of a button. When creating profiles, the ability to edit parameters from the same screen where the real-time temperature profile is displayed provides almost instantaneous feedback and reduces setup time.
BR720 BGA Rework Station Intuitive Touch-Screen Interface
Programmable Heating Rate, Target Temperature and Dwell Time for Upper and Lower Heaters
Sets of profile parameters for both leaded and lead-free solders can be divided into as many as eight individual segments for both the top and bottom heaters, each with its own heating rate, target temperature, and dwell time at the targeted temperature. Temperature and power settings for the IR underheater and the duration of the cooling fan operation are also saved as part of the parameter set.
BR720 BGA Rework Station Programmable Heating Rate
Real-Time Data Recording via Thermocouple Input with Profile Analysis and Print Function
A thermocouple input on the front of the unit allows real-time monitoring of temperatures at the desired location on the component or PCB. Collected data can be analyzed to ensure consistency with solder and/or component manufacturerís recommendations and can also be captured in bitmap format and written to a memory device connected to the BR720's standard USB port.
BR720 BGA Rework Station Real-Time Data Recording
Full Set of Vacuum Nozzles Included for Automatic Pick-Up and Placement of SMDs
The BR720 comes with a complete set of vacuum nozzles to handle components from 3 mm x 3 mm up to 60 mm x 60 mm and a maximum weight of 70 grams. Adapter sleeves attach to the standard vacuum nozzles to increase contact area and pick-up force. Components less than 3 mm x 3 mm should be placed manually and soldered in the BR720's Manual mode.
BR720 BGA Rework Station Full Set of Vacuum Nozzles
Bottom Heater Nozzles Included To Handle Most All BGA and CSP Applications
The BR720 is also shipped with 36 mm x 36 mm and 58 mm x 58 mm bottom heater nozzles to accommodate 95% of all rework applications involving removal and resoldering of BGAs, CSPs, and other devices that require bottom heating. Bottom heater nozzles can also be supplied in custom sizes for applications that require confinement of heat to a smaller area.
BR720 BGA Rework Station Bottom Heater Nozzles
Wide Variety of Upper Heater Nozzles To Solder or Desolder Virtually Any SMD
Nozzles for the upper heater are ordered based on the user's needs and are available in virtually any size from 7 mm x 7 mm to 55 mm x 55 mm to direct heat to the top surface and perimeter leads of a surface mounted device. A full listing of standard nozzles and pricing is available on the BR720 Insta-Quote page, and custom sizes are also available upon special request. Upper Heater Nozzles feature toolless, snap-in installation and can be swapped out in seconds.
BR720 BGA Rework Station Wide Variety of Upper Heater Nozzles


For more information, please go to the website: BR720 BGA Rework Station

PB2300 Fully-Programmable Semi-Automatic Stencil Printer w/ Vision Assist Alignment

Posted by Manncorp

PB2300 Fully-Programmable Semi-Automatic Stencil Printer w/ Vision Assist Alignment
To ensure repeatable performance and process stability, independent of operator skill, the Manncorp PB2300 provides a level of touchscreen programmability and parameter control uncommon in a benchtop SMT stencil printer. Dual high-magnification CCD cameras, paired with twin 7” LCD displays, also contribute to its exceptional accuracy by allowing easy, highly precise, stencil-to-pad alignment for the smallest 01005 chip components, μBGAs, and 0.3 mm (0.012”) fine-pitch QFPs. Tool-free clamping systems for squeegees up to 490 mm (19”) and frames up to 600 x 600 mm (23.6” x 23.6”) permit fast, seamless changeover between solder paste printing applications.

PB2300 Automatic Stencil Printer

PB2300 Automatic Stencil Printer LCD Touchscreen User Interface for Easy Setup and Operation
LCD Touchscreen User Interface for Easy Setup and Operation
The PB2300's PLC controller and touchscreen user interface allow password-protected programming of a wide range of parameter settings that can be stored as production files for various applications. Programmable settings include print speed, print head front and rear stroke positions, snap-off speed, snap-off distance, PCB thickness, and a correction factor that compensates for stretch as the stencil begins to wear. The software includes both an automatic mode and a manual/setup mode that allows step-by-step control of each segment of a print cycle, as well as a counter that keeps track of processed boards. The PLC's internal memory allows storage and retrieval of up to 100 different programs.
PB2300 Automatic Stencil Printer Small Footprint Compact Design
Small Footprint Compact Design w/ Extra-Large Frame Capacity
Although the PB2300 is small enough for the benchtop, its print area is extraordinarily large. This is due in large part to the unique, narrow design of its dual-squeegee print head which allows ample room for camera positioning and maximum utilization of the stencil area. As a result, the PB2300 maintains a print area of 480 mm x 400 mm (19" x 15.75") with frames up to 600 mm x 600 mm (23.6" x 23.6"); a ratio that is exceptional for a printer with automatic squeegee drive and CCD vision-assist alignment.
PB2300 Automatic Stencil Printer Maximized Area for Positioning of Dual CCD Cameras
Maximized Area for Positioning of Dual CCD Cameras
The large print area of the small-footprint PB2300 is also attributable to an efficient design that maximizes the available space for positioning of the dual CCD cameras. Each camera is attached to its own easily adjustable support bracket that allows quick positioning in the X and Y axes at opposite corners of the stencil for maximum alignment accuracy.
PB2300 Automatic Stencil Printer Laser Guides Facilitate Camera Positioning
Laser Guides Facilitate Camera Positioning
A laser source attached to each camera speeds up navigation and camera positioning during setup. This simple, yet convenient, feature is especially helpful when locating specific stencil apertures to be used as alignment targets on densely populated boards.
PB2300 Automatic Stencil Printer High Resolution LCD Displays for Precise Stencil-to-Pad Alignment
High Resolution LCD Displays for Precise Stencil-to-Pad Alignment
Dual 7" LCD displays mounted on the top of the PB2300's upper frame provide crystal-clear, through-stencil views of the solder pads on the PCB. A ring of high-brightness LEDs, surrounding each camera's lens, illuminates the target area for a clear view through the stencil apertures. Fine-adjustment knobs on the base of the unit are used to precisely align the stencil in the X-, Y-, and Ø axes.
PB2300 Automatic Stencil Printer Three-Position Squeegee Height Control for Quick Stencil Changes
Three-Position Squeegee Height Control for Quick Stencil Changes
The unique design of the PB2300's print head allows fast, "tool-less" stencil changes without having to remove its dual squeegees. When in the production mode, as shown in the adjacent illustration, the squeegees are either in the "up" position or the "down" position within the frame envelope. In the maintenance mode (or frame change mode), the squeegees are raised to a higher position above the frame envelope, allowing enough clearance for the stencil frame to be slid from the frame support channels when the clamping cylinders are released.
PB2300 Automatic Stencil Printer Snap-In Design Allows “Tool-less” Squeegee Changes
Patent-Pending, Snap-In Design Allows "Tool-less" Squeegee Changes
An exclusive snap-in clamping mechanism allows easy removal and replacement of squeegee blades without having to remove any screws or use any special tools. The PB2300 utilizes metal blade squeegees with integral paste deflectors to keep solder paste contained. Blades are available in various widths from 210 mm to 490 mm (8.27" to 19.29")
PB2300 Automatic Stencil Printer Flexible Frame Clamping System
Flexible Frame Clamping System Allows Changeover In Minutes
As shown in the adjacent photo #1, the PB2300's stencil frame support channels are easily adjusted to accept frames from 300 mm to 600 mm (11.8" to 23.6") wide. A convenient gauge on each channel indicates width settings in both inches and millimeters. Once the width is set, stencil frames of thicknesses from 18 mm to 33 mm (0.7" to 1.3") are simply slid into the channels as shown in photo #2. When the frame is in place, the simple flip of a switch on the front of the PB2300 activates four pneumatic clamping cylinders that lock the frame securely in place as shown in photo #3.
PB2300 Automatic Stencil Printer Complete Set of Universal Magnetic PCB Fixturing Included
Complete Set of Universal Magnetic PCB Fixturing Included
The PB2300 comes complete with a full supply of magnetic PCB mounting hardware that includes bottom side support pins and vacuum posts, fixed-position registration pins for PCBs with tooling holes, and a pair of edge-support rails that adjust for boards of thicknesses from 0.5 mm to 4 mm (0.020" to 0.157"). The edge-support rails provide a standard 24 mm (0.945") of clearance for double-sided PCBs and differences in the height of the PCB print surface from one setup to another (as shown in the illustration below the photo) are automatically adjusted in the software settings for the various programs.
PB2300 Automatic Stencil Printer Pneumatic Servo-Drive for Safe and Easy Opening and Closing
Pneumatic Servo-Drive for Safe and Easy Opening and Closing
For operator ease and safety, the PB2300 upper frame is opened and closed with the aid of a pneumatic servo system. Independent of the frame weight or squeegee head position, the upper frame can be lifted with minimal effort by simply pulling up on the handle on the front of the unit. The system will automatically hold the frame open at two separate positions; one-a partially opened position for maximum productivity that allows fast removal and loading of PCBs, and two-a wide 60° open position for board holder setup, cleaning, and maintenance. To protect the operator in the event of air or power loss, safety valves lock the upper frame position in accordance with CE safety requirements.
PB2300 Automatic Stencil Printer Easy Access for Paste Replenishment
Easy Access for Paste Replenishment
The hinged plexi-glass front shield of the PB2300 provides easy access for loading solder paste onto the stencil surface. It also provides additional clearance and easy sighting of the laser guides when setting up the positions of the CCD cameras for stencil alignment assistance.
Exceptional Print Quality and Repeatability
The adjacent photos show the outstanding print quality, edge definition, and homogeneous solder paste distribution that can be expected with the PB2300. It's ±20 μm (at 3σ) repeatability and extraordinary flexibility are the product of innovative engineering and high quality construction.
PB2300 Automatic Stencil Printer Exceptional Print Quality and Repeatability

FVX Pick and Place Machine Review from a Satisfied Customer

Posted by Manncorp

FVX pick and place machine customer review FVX pick and place machine customer review FVX pick and place machine customer review FVX pick and place machine customer review FVX pick and place machine customer review

You can also download the whole customer review letter here

For more information about FVX pick and place machine, please visit the website: Manncorp FVX benchtop pick and place machine

Manncorp to Unveil New Stencil Printer and Vapor Phase System at IPC APEX Expo 2013

Posted by Manncorp

VP500X vapor phase reflow oven Electronic manufacturing equipment provider Manncorp will be unveiling several all-new products at IPC APEX Expo Booth #118 in San Diego, California, February 19-21. Among the new products will be a compact, touchscreen-controlled vapor phase soldering system designed for the most complex, temperature-sensitive soldering and conductive adhesive curing applications. The batch-style system handles large PCBs and irregularly shaped assemblies up to 500 x 500 mm (20"x 20") and features a unique and highly efficient vapor recovery system for maximum ROI.





PB2300 semi automatic stencil printer A new dual-squeegee semiautomatic programmable stencil printer with dual CCD cameras for vision-assisted alignment will also be introduced. Microprocessor control of print stroke, print speed, squeegee pressure and vertical snap-off speed and distance allow ultrafine-resolution printing for the smallest 01005 and 0201 chip components, fine-pitch QFPs and BGAs. The system features a large 480 x 400 mm (19” x 15.75”) print area and pneumatic stencil frame clamping for quick changeovers.





automated optical inspection machine benchtop Also at the show will be the new Sherlock-300F benchtop AOI system, a radical redesign of desktop AOI featuring an iPad®-like multi-touch interface for programming and operation and a drawerless design where the PCB is transported through the machine on a conveyor for faster loading and unloading. Enjoy full defect coverage with low false call rates at an affordable price.





automated benchtop pick and place machine MC-400 automated benchtop pick & place brings a new level of accuracy and reliability to prototyping and low- to medium-volume production. MC-400 places 0201s through 100 x 150 mm components at rates to 3,000 pph with ±0.05 mm (0.002") placement accuracy. Dependable, user-proven software provides fast, simple setup and operation, even for complex surface mount assemblies.





dry box for electronics One of Manncorp's popular ULTRA-DRY desiccant dry cabinets, which provide humidity-controlled storage for moisture-sensitive devices (MSDs) to protect against moisture-related defects and costly product failures, will also be available on the APEX show floor.





Stop by Booth #118 to get a first look at the latest products from Manncorp designed to improve the quality and reliability of printed circuit board assemblies. www.manncorp.com/smt

New High-speed Pick & Place Machine for Nonstop Production of LED Boards

Posted by Manncorp

LED pick and place machine Manncorp introduces the MC-LEDV3, a new high-speed pick and place machine built to assemble LED tube lights, flexible LED strips and LED bulb boards. The MC-LEDV3 features three pick-and-place heads mounted on a high-precision, ball-screw-driven gantry. Simultaneous pickup, on-the-fly (vision based) component alignment, and feeder placement optimization combine to achieve placement rates of up to 10,000 LEDs per hour, per IPC-9850.

Unlike SMT pick and place machines that have been adapted for LED assembly, MC-LEDV3 is specifically designed for LED boards. Whether configured with a magnetic fixture worktable or an inline conveyor, MC-LEDV3 accommodates flexible strips, circular boards for LED bulbs, and long LED tube boards up to 70" (1800 mm) long. The machine places both standard and domed LEDs from 1 x 0.5 mm to 8 x 8 mm, with positive air pressure and Teflon®-coated nozzles ensuring the release of "sticky" components.

The feeders available for the MC-LEDV3 have also been designed specifically for LED assembly. Brushless motors ensure long life even through 24/7 production. The ability to splice tapes and to have the machine automatically switch to a different feeder when one runs empty means that the MC-LEDV3 can run nearly nonstop, producing LED boards shift after shift.

MC-LEDV3 LED pick and place machine is backed by a 2-year warranty and supported by Manncorp's experienced technical team. See details and pricing.

Sales and support offices in three locations: East (Willow Grove, PA), West (San Diego, CA) and Mexico. www.manncorp.com/smt

SMTA Process Certification Course Offered at ACI Technologies

From ACI Technologies

SMTA Process Certification Course Offered at ACI Technologies

ACI Technologies, a nationally recognized training facility, is pleased to join with the Surface Mount Technology Association to offer a SMTA Certification course in Surface Mount Processes.

W. Jim Hall, an instructor with 30 years of experience in the electronics assembly business, will conduct the course. Jim is the co-creator of the SMTA Process Certification Program.

Some of the topics to be covered are

  • Component Placement
  • Materials
  • Reflow Soldering
  • SMT Components
  • Stencil Printing
  • Wave Soldering
The presentation experience will be enhanced by a tour of the ACI Technologies production facility, where the equipment of a modern assembly plant can be reviewed. This includes: a stencil printer, pick and place machines, a reflow oven, a X-ray machine, rework machines, a inline PCB cleaner, a batch PCB cleaning machine, selective soldering machine, and more.

Date: Tuesday through Thursday, March 19-21, 2013

Pricing: SMTA Member: $1,195 Non-member: $1,360

RSVP: Katie Riggan by phone at 610.362.1295, or via email to registrar@aciusa.org

Location: ACI Technologies, Inc.
1 International Plaza, Suite 600
Philadelphia, Pa 19113

Upcoming Event: APEX EXPO IPC February 19-21, 2013

Posted by Manncorp

APEX EXPO IPC February 19-21, 2013. San Diego Convention Center, San Diego, California Booth # 118

APEX EXPO IPC


View Floor Plan

MC-LEDV3 High-Speed Dedicated LED Pick & Place Machine

Posted by Manncorp

Assemble LED tubes, flexible LED strips and circular LED light bulb boards at rates reaching 10,000 LEDs per hour with the new high-speed, dedicated MC-LEDV3 SMT placement equipment.

high speed pick and place machine for LED assembly


High-speed, high-efficiency design
The three pick-and-place heads mounted on the MC-LEDV3's high precision, ball-screw-driven gantry perform simultaneous pick-up to achieve rates to 10,000 LEDs per hour (per IPC-9850 standard). True "vision on the fly" alignment, with upward-looking cameras located on the placement heads, aligns components while the head is in motion, saving time over fixed-camera systems where the component has to brought over the camera for alignment before it can move to the placement area. Thanks to the included software, feeder locations are also optimized prior to placement to minimize head travel and tool changes.
high speed pick and place machine for LED assembly
Specifically designed for LED
Unlike standard pick and place machines that have been adapted to LED assembly, the MC-LEDV3 LED pick and place machine is purpose-built, allowing it to do its one thing—building LED boards—really well, starting with the types of boards it can handle.

Whether the machine is purchased with the worktable and magnetic board fixture or an inline conveyor, the MC-LEDV3 can assemble long LED boards, such as those used for tube lights, up to 47.2" (1200 mm) in a single pass. (For jobs that need even more length, the system can also be purchased with a max board length of 70.9" (1800 mm).)

Flexible PCBs, circular boards for LED light bulbs and even irregularly shaped boards can also be assembled, quickly, accurately and reliably.

Each of the MC-LEDV3's three placement heads features positive air pressure to release 'sticky' LED components. Non-stick, Teflon®-coated nozzles—including custom nozzle designs—are also available.

The MC-LEDV3 places LED components from 0402 to 0505 (max LED size is 8 mm x 8 mm x 8 mm), including both standard and irregularly shaped LEDs. Domed LEDs can be safely placed using placement nozzles designed to not come in contact with the optical lens during pick-up and placement, protecting the component's overall light performance and reliability.
high speed pick and place machine for LED assembly
24/7 workhorse
The MC-LEDV3 pick and place offers nonstop production. Its ability to automatically switch to a different feeder when an in-use feeder runs out of components allows the operator to refill and replace the empty feeder without taking production offline at all.

MC-LEDV3 holds up to 16 tape feeders. These special feeders use brushless motors for longer feeder life under around-the-clock production conditions. With these feeders, it is also possible to splice a new reel onto an old one to minimize production interruption.
high speed pick and place machine for LED assembly
Software simplifies production
Several powerful software tools are included with the MC-LEDV3 SMT pick and place machine, including the UCAD® universal CAD import and conversion utility to simplify placement programming, a feeder arrangement optimizer to minimize head travel and tool changes, and real-time monitoring of production, which displays a virtual view of the progress of current product under assembly along with placement rate, placement time and production count.

Companies that already have one or more MC series SMT pick and place machines in their facility will find the MC-LEDV3's software interface immediately familiar, which means a zero learning curve when it comes to programming and operating this machine.
high speed pick and place machine for LED assembly
high speed pick and place machine for LED assembly


For more information, please visit the website: Manncorp MC-LEDV3 pick and place machine for LED assembly

Thermal Profiling for Reflow

From ACI Technologies Inc.

Technical Tips from ACI


Reflow oven temperature profiling is the most important aspect of proper control of the solder reflow oven process. It may appear to some to be a magical art practiced by a select experienced few, who are able to divine the proper settings for a reflow oven by reading graphs as if they were tea leaves. This does not have to be true. This article outlines a systematic method by which engineers and technicians can implement a successful reflow process from scratch.

The most basic type of profile is a ramp-to-peak (RTP) profile as shown in Figure 1. This type of profile is one where the rate of temperature increase over time is virtually constant for the entire heated portion of the profile. An RTP profile type is very common and is the easiest type to implement. There are three critical parameters for all solder materials on an RTP profile: peak temperature, rate of temperature increase over time (slope), and time above liquidus.

Ramp-to-peak reflow profile
Figure 1: Ramp-to-peak profile.

The peak temperature is exactly what it appears to be: the highest temperature experienced during the reflow process. The slope is the rate of temperature increase over time during the reflow process. The time above liquidus parameter is the time spent above the temperature at which the solder alloy is fully melted. These parameters will vary based on the alloy (especially peak temperature and time above liquidus) and the flux formulation (especially slope). The primary source for these parameters is the manufacturer’s data sheet for the solder paste that is used. In many cases, these specifications will provide an acceptable range. In some cases, only a minimum or maximum requirement is provided. This article will use a fictional solder paste that provides the following requirements: peak temperature of 240-255°C, profile slope of 0.8-1.0°C/second, and a time above liquidus of 30-60 seconds.

The first step of developing a reflow profile is to set the conveyor speed. This is the most important parameter to set correctly as any change during process development will invalidate all of the work accomplished to that point. The conveyor speed can be calculated as long as all the necessary information is available. The technician must know (or measure) the heated length of the oven and determine the required peak temperature and profile slope.

The next step is to calculate the time needed to reach the peak temperature by determining the difference between the peak temperature and room temperature and dividing that result by the slope. In our hypothetical example, the time to peak is (247.5 - 25) / 0.9 = 247.2 seconds. Notice that the midpoint was used for each range? This ensures that our calculated conveyor speed is near the center of the acceptable range.

Once the time to peak has been determined, the conveyor speed is calculated by dividing the heated length of the oven by the time to peak. Our hypothetical oven has 84 inches of heated length, resulting in a conveyor speed of 84 / 247.2 = 0.34 inches/second or approximately 20 inches/minute. The precision of the conveyor speed setting is not critical since the center of the range was used for peak temperature and profile slope, so rounding the value is acceptable. Once this value is determined, it will remain unchanged for the balance of the profile development.

The next task is to determine the goal temperature for the assembly at the end of each oven zone. In order to calculate the goal temperature at the zone exit, the technician must know the number of heated zones in the oven, the peak temperature desired, and the exit temperature of the previous zone. The calculation begins by determining the desired temperature rise for each zone, which is calculated by dividing the difference between the peak temperature and room temperature by the number of heated zones. In our example the oven has seven heated zones, so the calculation is (247.5 - 25) / 7 = 31.8 or approximately 32°C per zone.

The goal temperature for zone 1 is then calculated by adding the previous zone exit temperature (room temperature for zone 1) and the temperature rise per zone. For our example, this becomes 25 + 32 = 57°C. This is the temperature the assembly should reach by the end of the first zone, but the oven should be set to a higher value. There will be a difference between the oven set point and the temperature of the assembly during the reflow process. A good starting point is approximately 20°C higher, so the oven’s first zone should be set to 80°C. The subsequent zones can remain at their default value (typically room temperature) for now. Once the first zone has reached operating temperature, a measurement can be taken by passing an assembly with thermocouples and a data logger through the oven. After each pass, the assembly's temperature is compared to the goal and the oven set point is adjusted, as necessary, until the assembly exits the first zone at approximately 57°C. This process is repeated for each zone in sequence.

It is important to ensure that the slope of the profile curve remains constant throughout the zone. A profile that flattens at the end of any zone indicates the assembly is nearly reaching temperature equilibrium in that zone. This can be due to a high convection rate which should be reduced, if possible. If the oven does not have adjustable convection rates, the conveyor speed will need to be increased. If the conveyor speed is changed, the expected slope needs to be recalculated to ensure it is within specification. This is accomplished in the same manner as the determination of the conveyor speed, except the conveyor speed is now a known value, and the expected slope is the unknown value. If the conveyor speed is changed, the entire zone setting process should start again from zone 1.

The final two (or three) zones, typically, are where reflow occurs and is where the profile should exceed the liquidus point of the solder. The entire time the profile spends over the liquidus point of the solder is counted towards the time above liquidus parameter. This includes the time after the peak temperature (which will occur at the end of the last heated zone). The peak temperature and time above liquidus are typically adjusted by modifying the temperatures of the last two or three zones. This is accomplished through trial and error. However, by following the system described in this article the trial and error portion of developing a profile is limited to minor changes in a limited number of zones at the end of the process.

ACI Technologies can provide assistance developing reflow processes; call the Helpline at 610.362.1320, email helpline@empf.org, or visit http://www.aciusa.org

Jason Fullerton
Senior Product and Applications Engineer
ACI Technologies, Inc.

Manncorp CR Series Reflow Ovens for Every Reflow Soldering Application

Posted by Manncorp

Lead-free CR series SMT reflow ovens are designed for the mid-volume assembler with limited space requirements. Shorter heating tunnels lead to shorter overall system length without sacrificing performance, process width or features. In fact, CR series full-convection reflow ovens offer the best cost/performance ratio available.

CR series reflow oven
CR series reflow oven


For more information, please visit the website: Manncorp Lead-free CR series convection reflow ovens

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